With the continuous development of technology, chip packaging technology is also constantly innovating. Inverted chip packaging technology, as an advanced packaging form, has many advantages, such as improving chip integration and reducing packaging volume. However, achieving uniform and efficient coating during the flip chip packaging process has always been a technical challenge. To address this issue, an ultrasonic flip chip packaging atomization spraying system has been introduced into flip chip packaging.
Ultrasonic spraying system is a technology that uses ultrasonic vibration to uniformly spray coating materials on the surface of substrates. This technology can achieve uniform coating of complex shapes and microstructures, and has advantages such as high efficiency and environmental friendliness. In flip chip packaging, ultrasonic spraying system can achieve faster and more uniform coating effect, improve production efficiency and yield. Inverted chip packaging requires placing the chip on a substrate and filling solder between the chip surface and the substrate. To achieve this process, it is necessary to pre treat the surface of the chip to have appropriate roughness and cleanliness. The ultrasonic spraying system can improve the surface quality of chips by uniformly coating them, providing a better foundation for subsequent solder filling processes. During the process of filling solder, it is necessary to accurately fill the gap between the chip and the substrate with solder. If the filling is uneven or bubbles are generated, it will affect the quality and reliability of the packaging. The ultrasonic spraying system can achieve a more efficient and reliable filling process by uniformly coating the solder and precisely controlling the coating thickness. After the solder filling is completed, the package needs to be soldered and tested. If there are defects or uneven coatings on the surface of the chip, it will affect the results of soldering and testing. The ultrasonic spraying system can reduce surface defects and uneven coating by uniformly coating the chip surface, improving the reliability of welding and testing.
Ultrasonic spraying system, as an advanced coating technology, has broad application prospects in flip chip packaging. It can improve production efficiency and yield, reduce surface defects and uneven coatings, and provide a better foundation for subsequent welding and testing. In the future, with the continuous development of technology, ultrasonic spraying systems will be applied and promoted in more fields.
One of the ancestors of ultrasonic selective spray flux, with rich professional knowledge, can apply a highly uniform flux film to the target area, almost without overspray or blockage. Ultrasonic spraying provides a precise, repeatable, and controllable spraying solution for spraying flux onto contact pads. It can spray a very thin and uniform layer of flux to prevent excessive residue of flux, which can lead to poor bottom filling and result in unreliable products. Strictly controlling the thickness of the flux can also prevent mold floating, thereby avoiding downtime and poor mold connections. Minimal overspray can prevent solder flux from coming into contact with passive components. Other methods such as spraying, dipping flux and pressure nozzle spray can not apply thin target flux layer. Realize high throughput through automated XYZ motion and conveyor functions. Multiple nozzle configurations can further accelerate the spraying process.
The benefits of using ultrasonic spraying in flip chip packaging applications:
1. Highly controllable spraying avoids rework costs caused by excessive spraying.
2. Able to control the thickness of the flux, with coatings as thin as 20 microns.
3. The uniform flux layer eliminates chip floating and avoids chip and substrate scrap.
4. The ultrasonic atomization coating system can receive processing trays composed of multiple substrate configurations.
5. Non clogging ultrasonic spray requires minimum cleaning and provides high repeatability, because the spray performance will not be affected by the gradual blockage of the pressure nozzle.
6. It has been proven to be compatible with indium flux.
