Application and Effect of Ultrasound in Target Material Binding
Target binding is a technique that binds a target material to a substrate, also known as target welding. In recent years, ultrasonic target binding technology has emerged as a new target binding method. This technology provides an environmentally friendly welding solution without the use of flux, fundamentally avoiding various problems of conventional flux welding technology, and thus providing stable and reliable welding. Its superiority has gradually been reflected in the field of target binding.
Why does using ultrasonic technology to bind targets not require flux?
The ultrasonic generator converts current into high-frequency electrical energy. The converted high-frequency electrical energy is converted back into mechanical motion of the same frequency through a transducer, generating tens of thousands of high-frequency vibrations per second. This high-frequency vibration reaches a certain amplitude and transmits ultrasonic energy to the welding area through a variable amplitude pole. The high-frequency vibration causes the oxide layer in the welding area to peel off, and while the microbubbles are discharged, the target material enters the microcavity occupied by these microbubbles, firmly binding the target material to the substrate, achieving welding without the use of flux.
What are the advantages of ultrasonic target binding technology compared to traditional flux welding methods?
1. Do not use flux
Flux will generate micro bubbles inside the welding process, which can cause welding defects such as cracks over time. Ultrasonic technology does not use flux during the welding process, so it will not cause progressive corrosion due to residual flux in the welding area.
2. Environmentally friendly welding solutions
Ultrasonic welding technology does not use flux, so it does not require gas discharge facilities or wastewater treatment facilities to treat harmful gases generated by flux.
3. The coating is firm and will not peel off.
4. The coating is uniform, without blind spots or ripples.
5. Reduce production costs
No need for flux process and flux cleaning process, greatly reducing equipment and production costs, and improving productivity by simplifying welding process.
6. Improve production efficiency
Applying a copper plate with an area of 1500 * 190mm only takes 15 minutes (vibration twice). Applying ITO glass with an area of 50 * 50mm only takes 1 minute (vibration 3 times).
7. Assist in developing new products
Traditional flux welding methods cannot be used, while ultrasonic technology can be used to bond materials that are difficult to weld and develop new products.
Ultrasonic target binding equipment is also known as ultrasonic indium coating machine or ultrasonic indium loading machine because the most common binding target is indium. The drawbacks of manual indium coating are very obvious. Firstly, the indium coating is uneven, which can lead to poor performance of the coated material; Secondly, due to the manual scraping method used, the indium coating may become unstable and prone to detachment; Again, the efficiency of manual scraping and coating is very low, which consumes a lot of manual labor; Finally, due to control or other reasons, it may lead to the waste of indium metal. The ultrasonic indium coating technology has effectively solved these problems.
For substrates of different shapes, ultrasonic indium coating machines can be used for surface coating of flat targets, inner circular targets, and outer circular targets, replacing the outdated technology of manual scraping in the past.
