Ultrasonic Coating Technology for Photoresist Spraying

Ultrasonic spraying is a simple, economical, and reproducible process for photoresist and polyimide coatings. The ultrasonic coating system can use simple layering techniques to finely control flow rate, coating speed, and deposition amount.
Ultrasonic spraying technology is used for semiconductor photoresist coatings. Compared with traditional spinning coating and impregnation coating processes, it has the advantages of high uniformity, good microstructure encapsulation, and controllable coating area. In the past decade, the application of three-dimensional microstructure photoresist coatings has been fully demonstrated. The process of preparing photoresist coatings by ultrasonic atomization spraying is significantly superior to traditional spinning coatings in terms of microstructure packaging and uniformity.
The ultrasonic spraying system can accurately control the flow rate, coating speed, and settling volume. Low speed spray molding defines spray as an accurate and controllable pattern to avoid excessive spray when producing very thin and uniform layers. This ultrasonic spraying system can control thickness from sub micron to over 100 microns and can cover any shape or size.

Characteristics of ultrasonic coating technology for photoresist:
◆ Uniform film coverage of various surface contours
◆ Non contact spraying
◆ Micro airflow spraying, multiple liquid feeding schemes
◆ High speed control accuracy
◆ High liquid utilization rate
◆ High flexibility in chemical and coating performance
◆ High transmission efficiency and minimal waste
◆ Repeatable mature spraying process

