Ultrasonic Spraying Protective Film Specific Coating Before Silicon Wafer Cutting

Hangzhou Shengtu Technology Co., Ltd. is one of the leading manufacturers and suppliers of ultrasonic spraying protective film specific coating before silicon wafer cutting in China. Welcome to buy high quality customized products at low price from our factory. Contact us for more details.

 

 

 

Ultrasonic spraying of protective coating prior to silicon wafer dicing has been verified as a dependable, highly repeatable and high-efficiency process. It is used to deposit different chemical materials on silicon substrates before dicing, grinding and polishing, so as to safeguard wafers and solder bumps. Typical applicable materials cover Z-Coat, PMMA and other strippable resins.

FUNSONIC provides customizable nozzle systems to address clients' unique technical specifications and technical bottlenecks in pre-dicing protective film coating for silicon wafers.

This ultrasonic protective coating solution features flexible adaptability to workpieces of arbitrary shapes and dimensions. Coating thickness can be precisely tuned from submicron level up to more than 100 microns. As a viable substitute for spin coating and conventional air spraying, this coating system delivers obvious technical advantages.

 

 

 

Ultrasonic nozzles are widely applied in photolithography processes within the semiconductor industry. Semiconductor manufacturers adopt ultrasonic spraying technology to coat photoresist developer on silicon and gallium arsenide chip substrates. As a key chemical material, photoresist developer enables the visualization of circuits imaged by optical steppers. In the spraying process, the nozzle is positioned above the chip, and an XYZ three-axis servo motor system precisely controls the ultrasonic nozzle to achieve uniform coating distribution across the substrate. Featuring gentle and continuous atomization, ultrasonic spraying enhances chemical activity, boosts developing efficiency, and effectively reduces liquid rebound and material waste. Practical data verifies that this technology can cut material consumption by up to 70% while delivering superior critical dimension control.

 

Compared with conventional spin coating, ultrasonic nozzles deliver far more uniform material distribution and eliminate the reliance of liquid spreading on surface tension. Traditional spin coating works by dispensing liquid materials onto local areas of chips in the form of liquid puddles or streams, which are then spread across the chip surface by centrifugal force. This process demands strict control over temperature and solvent evaporation rate to guarantee intact, uniform coating results. In contrast, ultrasonic nozzles atomize coating materials evenly over the entire chip surface to form a continuous thin film. This processing method avoids the interference of solvent evaporation and surface tension issues, completely eliminating sputtering phenomena and backside deposition problems.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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