Photoresist Coating System for Semiconductor lithography

Compared with traditional spin coating, photoresist coatings using ultrasonic spraying have advantages in depositing more uniform coatings, especially along the top of the sidewalls of high aspect ratio grooves and V-shaped groove structures. Centrifugal rotation cannot deposit uniform coatings along the sidewalls, and will not deposit too much photoresist at the bottom of the cavity.

Ultrasonic spraying is a simple, economical, and reproducible process for photoresist coating in photolithography wafer processing. FUNSONIC's ultrasonic atomization coating system uses advanced layering technology to finely control flow rate, coating speed, and deposition amount. Low speed spray molding defines atomized spray as an accurate and controllable pattern to avoid overspray and produce very thin and uniform layers. The direct spraying using ultrasonic technology has been proven to be a reliable and effective method for depositing photoresist onto 3D microstructures, thereby reducing equipment failures caused by excessive exposure of metals to etchants.

Advantages of ultrasonic nozzles in photoresist coating process:

1. Uniform film coverage of various surface contours.
2. Able to coat high aspect ratio grooves with excellent uniformity.
3. Non clogging atomizing spray.
4. Capable of depositing highly uniform single micron thin layers.
5. Repeatable mature spraying process.