Ultrasonic Spraying Protective Film Coating System Before Silicon Wafer Cutting

The ultrasonic spray protective film coating system before silicon wafer cutting has been proven to be a reliable, repeatable, and efficient method for applying various chemicals to silicon before cutting, grinding, and polishing to protect the wafer and bumps. Common chemical substances include Z-Coat, PMMA, and other easily removable chemicals. FUNSONIC's nozzle system can be customized to meet customers' specific coating requirements and challenges for cutting protective films.

Ultrasonic spraying systems have been proven to be suitable for various applications that require uniform and repeatable material coatings. By controlling the thickness from submicron to over 100 microns and being able to coat any shape or size, coating systems are a viable alternative to other coating techniques such as rotary and traditional spraying.

FUNSONIC's coating system can precisely control flow rate, coating speed, and deposition amount using simple layering techniques. Low speed spray molding defines atomized spray as an accurate and controllable pattern to avoid overspray and produce very thin and uniform layers.

The advantages of using ultrasonic coating technology for protective wafer coating processes include:

1. Rapid and uniform film coverage of various surface contours.
2. High flexibility in chemical and coating properties.
3. Non clogging atomizing spray.
4. High transmission efficiency with minimal waste.
5. Highly reproducible mature spraying process.