Ultrasonic Indium Coating Target Binding Machine

Ultrasonic indium coating machine, alternatively called target bonding machine, is precision metal coating equipment featuring flux-free operation and purely physical metallurgical bonding. It is primarily applied for bonding sputtering target backplates and pre-coating indium layers on electronic components, serving as a replacement for the conventional manual indium scraping process.

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1. Electrical energy conversion for ultrasonic vibration

The equipment generator produces high-frequency electrical signals ranging from 20 to 30kHz. These signals are converted into mechanical vibration energy via the transducer. The vibration amplitude is then boosted to 3–20μm through the waveguide and delivered to the indium coating welding head for subsequent processing.

2. Oxide film removal via cavitation effect

Indium metal melts at 156.6°C. High-frequency vibration acts on the molten indium to trigger continuous microbubble generation and implosion. This physical effect strips off the oxide layers on the surfaces of substrates and indium materials. Meanwhile, internal gas is discharged from the bonding interface to effectively avoid pore defects.

3. Metallurgical bonding through atomic diffusion

Ultrasonic micro-friction softens molten indium and enhances its fluidity and spreadability. The softened indium fully penetrates the micro-pits and tiny gaps on the substrate surface. This process forms a dense, pore-free metal bonding layer with excellent adhesion, and the entire bonding procedure requires no solder flux at all.

Team Advantages

Professional team, advanced technology and strict production standards. FUNSONIC combine professional ultrasonic expertise, strict quality control and thoughtful after-sales service. We focus on your needs and deliver stable, cost-effective solutions for long-term cooperation.